Description

• Works with various substrates (metal, glass, plastic, wafer, etc.)
• There are different ways of removing glue
• No residue after debonding
• Especially suitable for cutting wafers, glass, and ceramic plates, with excellent adhesion to the substrate
Traditional glue is only removed by strong corrosive organic solvents or destructive methods.
Selecting the appropriate temporary adhesive can achieve the removal of the glue without damaging the object, and it can also be used for processing and fixing in production, such as cutting wafers, glass, and ceramic plates.